By Gordon Roberts, Friedrich Taenzler, Mark Burns
With the proliferation of complicated semiconductor units containing electronic, analog, mixed-signal, and radio-frequency circuits, modern day engineer needs to be fluent in all 4 circuit varieties. Written for complicated undergraduate and graduate-level scholars, in addition to engineering pros, An Introduction to Mixed-Signal IC try and Measurement, moment variation, encompasses analog, mixed-signal and radio-frequency circuits assessments, with many suitable business examples. The textual content assumes an exceptional historical past in analog and electronic circuits and a operating wisdom of desktops and desktop programming.
An advent to Mixed-Signal IC try and Measurement, moment version, comprises examples and illustrations--featuring cutting-edge commercial technology--to increase and brighten up the textual content. The booklet additionally introduces large-scale mixed-signal circuit and person circuit assessments, discusses the value-added merits of mixed-signal IC trying out to a manufacturer's product, and obviously defines the function of the attempt engineer.
New to This Edition
* a brand new bankruptcy on RF attempt equipment and basics of RF Testing
* a brand new bankruptcy on Clock and Serial info Communications Channel Measurements
* assurance of RF load board design
* New assurance of probabilistic reasoning for mixed-signal trying out
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Additional resources for An Introduction to Mixed-Signal IC Test and Measurement
5. Relay coil driver with ﬂyback protection diodes. 1 Digital Vectors A mixed-signal tester must test digital circuits as well as mixed-signal and analog circuits. The mixed-signal and digital-only sections of the DUT are exercised using the tester’s digital subsystem. The digital subsystem can present high, low, and high-impedance (HIZ) logic levels to the DUT. It can also compare the outputs from the DUT against expected responses to determine whether the digital logic of the DUT has been manufactured without defects.
The per-pin measurement circuits of a pin card form a low-resolution, low-current DC voltage/current source for each digital pin. The per-pin circuits also include a relatively low-resolution voltage/current meter. The low-resolution and low-current capabilities are usually adequate for performing certain DC tests like continuity and leakage testing. These DC source and measure circuits can also be used for other types of simple DC tasks like input or output impedance testing. Some testers may also include overshoot suppression circuits that serve to dampen the overshoot and undershoot characteristics in rapidly rising or falling digital signals.
Circuit modifications can be made in a number of ways, including laser trimming, fuse blowing, and writing to nonvolatile memory cells. The test engineer is also responsible for reducing the cost of testing through test time reductions and other cost-saving measures. The test cost reduction responsibility is shared with the product engineer. The product engineer’s primary role is to support the production of the new device as it matures and proceeds to profitable volume production. The product engineer helps identify and correct process defects, design defects, and tester hardware and software defects.
An Introduction to Mixed-Signal IC Test and Measurement by Gordon Roberts, Friedrich Taenzler, Mark Burns